August 15, 2022


Technology Forever

Insights on the Semiconductor Packaging World Market to 2027 – That includes Amkor Know-how, ASE Group and Chipbond Engineering Among Other individuals

Dublin, Jan. 15, 2021 (Globe NEWSWIRE) — The “Semiconductor Packaging – World Industry Trajectory & Analytics” report has been included to’s giving.

The publisher provides yrs of investigation expertise to the 7th version of this report. The 290-web site report provides concise insights into how the pandemic has impacted output and the purchase aspect for 2020 and 2021. A small-expression phased recovery by essential geography is also dealt with.

Global Semiconductor Packaging Sector to Attain $41.8 Billion by 2027

Amid the COVID-19 crisis, the world-wide industry for Semiconductor Packaging approximated at US$26.7 Billion in the 12 months 2020, is projected to access a revised size of US$41.8 Billion by 2027, developing at a CAGR of 6.6% in excess of the analysis period of time 2020-2027.

Natural substrates, just one of the segments analyzed in the report, is projected to file a 7.4% CAGR and reach US$22.3 Billion by the finish of the analysis period. Right after an early assessment of the organization implications of the pandemic and its induced financial crisis, growth in the Direct frames segment is readjusted to a revised 6.3% CAGR for the up coming 7-yr period of time.

The U.S. Industry is Approximated at $7.2 Billion, Although China is Forecast to Develop at 10.2% CAGR

The Semiconductor Packaging industry in the U.S. is estimated at US$7.2 Billion in the 12 months 2020. China, the world`s next premier financial system, is forecast to access a projected marketplace dimensions of US$9.1 Billion by the year 2027 trailing a CAGR of 10.2% above the evaluation period of time 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, just about every forecast to grow at 3.5% and 6% respectively about the 2020-2027 period of time. In just Europe, Germany is forecast to mature at close to 4.2% CAGR.

Bonding wires Segment to Document 5.8% CAGR

In the international Bonding wires section, Usa, Canada, Japan, China and Europe will push the 5.3% CAGR believed for this section. These regional markets accounting for a merged sector size of US$3 Billion in the 12 months 2020 will get to a projected dimension of US$4.3 Billion by the close of the assessment period. China will continue being amongst the quickest increasing in this cluster of regional markets. Led by international locations these types of as Australia, India, and South Korea, the marketplace in Asia-Pacific is forecast to arrive at US$5.7 Billion by the calendar year 2027, even though Latin The us will extend at a 7% CAGR as a result of the evaluation interval.

Competitors discovered in this market place include, among other folks:

  • Amkor Technology, Inc.
  • ASE Team
  • Chipbond Technologies Company
  • ChipMOS Systems, Inc.
  • Fujitsu Ltd.
  • Intel Corporation
  • Interconnect Programs, Inc.
  • Powertech Technological know-how, Inc.
  • Samsung Electronics Co., Ltd.
  • Siliconware Precision Industries Co., Ltd. (SPIL)
  • STATS ChipPAC Pte. Ltd.
  • Tianshui Huatian Know-how Co., Ltd.
  • Unisem (M) Berhad
  • UTAC Holdings Ltd.

Key Matters Coated:



1. Marketplace OVERVIEW

  • Global Competitor Current market Shares
  • Semiconductor Packaging Competitor Sector Share Circumstance Globally (in %): 2019 & 2025
  • Influence of Covid-19 and a Looming Worldwide Recession

2. Focus ON Choose Players

3. Sector Tendencies & Motorists

4. Worldwide Current market Point of view

III. Marketplace Analysis

IV. Levels of competition

  • Whole Businesses Profiled: 41

For a lot more data about this report pay a visit to

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